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DS: Dünne Schichten

DS 33: Postersitzung

DS 33.50: Poster

Dienstag, 18. März 1997, 16:15–17:45, Aula

The elimination of microparticles during vacuum arc deposition of Ti — •V. Semenov^1,2, B. Straumal^1,2,3, N. Vershinin³, Y. Brechet⁴, and W. Gust¹ — ¹Max-Planck-Institut für Metallforschung and Institut für Metallkunde, Seestr. 75, 70174 Stuttgart — ²Institute of Solid State Physics, Chernogolovka, Moscow District, 142432 Russia — ³Institute of Vacuum Technology, Chajanov str. 8/26, Moscow, 125047 Russia — ⁴LTPMC/ENSEEG/INPG, B.P. 75, 38402 St. Martin d’Heres, France

The process of the incorporation of microparticles into a growing coating is very important for the technology of vacuum arc deposition. Recently, it has been shown that the microparticles disappear gradually during their flight from the target to the substrate. Two different mechanisms for the in-flight elimination of microparticles are proposed: (1) Erosion due to the sputtering in the dense flux of ions, and (2) fragmentation of droplets. Thin Ti coatings were vacuum arc deposited on a silica glass substrate. The size dependence of the microparticles was studied with the aid of scanning electron microscopy. It was shown that the evolution of the size dependence with increasing time of flight corresponds to the sputtering mechanism, at least for small particles. The financial support from the TRANSFORM programme of BMBF, the Alexander von Humboldt Foundation and the INTAS project 93-1451 is acknowledged.