Regensburg 1998 – wissenschaftliches Programm

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HL: Halbleiterphysik

HL 24: Poster II

HL 24.36: Poster

Mittwoch, 25. März 1998, 10:30–19:00, A

Thermal Conductivity Measurment Set-up — •Andrej Denisenko, J"org Bonhaus, Frank Blum, and Wolfgang R. Fahrner — FernUniversit"at Hagen, Lehrgebiet Bauelemente der Elektrotechnik, Haldener Str. 182, 58084 Hagen, Germany

A technique for measuring the perependicular to the plane thermal conductivity of thin (below 1 mm) samples has been developed. The technique is based on the direct injection of heat into the sample through diamond indentor. The thermal conductivity of the sample is calculated by measuring the size of the indentor-sample contact, the heat flux and the temperature gradient across the sample in the stationary regime. The measured data is incorporated in a 2-D simulation software. The exact value of the thermal conductivity is obtained by fitting the temperature fields inside the simulation to the experimental values. The technique has been applied for measuring the thermal conductivity of various ceramics (SiC(Al), Al2O3). The contact heat resistance has been evaluated of various alloys used as the solder between CVD diamond films and copper substrates in the flip chip bonding process.