Regensburg 1998 – scientific programme

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VA: Vakuumphysik und Vakuumtechnik

VA 5: Vakuumverfahrenstechnik 2

VA 5.2: Invited Talk

Tuesday, March 24, 1998, 14:10–14:50, H48

300 mm Wafer - The Challenge in Manufacturing Development for Future Semiconductor Processing — •P. K"ucher and J. R"ustig — Siemens Microelectronics Center Dresden GmbH u. Co. OHG

The transition to 300 mm follows a long term economically driven trend with a typical consumption peak from one wafer size generation to the next of about 6 years. This reveals a move into volume production for 300 mm in 2000 / 2001. Market growth, chip size increase associated with a doubling of performance every two years and a cost / die productivity improvement of about 30 Critical issues and potential blocking points of the transition from development to volume manufacturing will be discussed. International industry standards are required to improve factory investment effectiveness, upgradability, reduction of start-up time and factory logistics. New concepts and innovations for equipment, wafer processing, material / wafer transport and line monitoring have to be developed in a synchronized effort of tool suppliers, IC manufacturers and institutes / universities. Some processing limits and wafer quality issues will be discussed.