Berlin 2001 – wissenschaftliches Programm

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CPP: Chemische Physik und Polymerphysik

CPP 15: Nanostructures

CPP 15.1: Vortrag

Donnerstag, 5. April 2001, 17:45–18:05, 112

Enhancement of noble metal adhesion on polymers — •Dolgner Kai, Bechtolsheim Conrad von, Zaporojtchenko Vladimir, Behnke Knut, Strunskus Thomas, and Faupel Franz — Technische Fakultät der Universität Kiel, Kaisserstrasse 2, 24143 Kiel

The metallization conditions and the resulting interfacial morphology affect many properties of metallized plastics, particularly the adhesional strength of the interface. We will report selected examples of interfaces obtained by evaporating noble metals) onto the different polymers BPA-PC, PMDA-ODA and on PI. The interfaces were characterized by means of TEM, XPS and AFM. An interesting approach to obtain a defined morphology involves the formation of metal nanoclusters of typically 10-30 nm diameter on the polymer surface and their controlled embedding into the polymer substrate by a subsequent annealing process near the glass transition temperature. The strongest enhancement of the initially low peel strength between noble metals and polymers was achieved up to now in the ongoing investigations by post-metallization annealing near and above the glass transition temperature. A tentative model is proposed to explain the observed adhesion enhancement.