Regensburg 2002 – wissenschaftliches Programm

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SYPF: Struktur und Dynamik in dünnen Polymerfilmen

SYPF 2: Poster Session

SYPF 2.26: Poster

Donnerstag, 14. März 2002, 09:00–18:00, Poster B

Enhancement of Noble Metal Adhesion on Polymers by Heat Treatment and Cluster Embedding — •Kai Dolgner, Vladimir Zaporojtchenko, Jörn Erichsen, Conrad von Bechtholsheim und Franz Faupel — Lehrstuhl für Materialverbunde, Technische Fakultät der Universität Kiel, Kaiserstr. 2, 24143 Kiel, Germany

If metals with a low reactivity are evaporated onto an untreated polymer surface they form clusters during the initial stages of polymer metallization. The metallization conditions and the resulting interfacial morphology affect many properties of metallized plastics, particularly the adhesional strength of the interface. These interfaces were characterized by means of transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). An interesting approach to obtain a defined morphology involves the formation of metal nanoclusters of typically 2-10 nm diameter on the polymer surface and their controlled embedding into the polymer substrate by a subsequent annealing process below the bulk glass transition temperature Tg. This embedding process can be observed in situ by XPS. The adhesion can be enhanced by post-metallization annealing near and above the glass transition temperature or by a two-step embedding and metallization process. We will present the effects of chain mobility and glass transition temperature on the controlling of the embedding process.