Dresden 2003 – scientific programme

Parts | Days | Selection | Search | Downloads | Help

HL: Halbleiterphysik

HL 25: Organische Halbleiter II

HL 25.5: Talk

Tuesday, March 25, 2003, 16:15–16:30, BEY/81

Printing of Integrated Polymer Circuits — •Robert Blache, Alexander Knobloch, Andreas Ullmann, Jürgen Ficker, Dietmar Zipperer, Walter Fix, and Wolfgang Clemens — SIEMENS AG, CT MM 1, Paul-Gossen-Str. 100, 91052 Erlangen

We report on the fabrication of Integrated Polymer Circuits based on soluble polymers. The advantage of these polymers is their printability, which allows fast and cheap fabrication processes.

The basic component for Integrated Circuits is the polymer field effect transistor (PFET) with polymer semiconducting and insulating layer. As a semiconductor we use Poly(3-alkylthiophene) (P3AT). Integrating several PFETs and applying standard lithography methods leads to fast polymer circuits like inverters or ring oscillators with frequencies above 100 kHz[1]. These devices also show high stability in performance over time.
Using conductive polymers as electrode material, the whole PFET is processed by printing techniques like doctor blading and pad printing. We present our latest printing results in comparison with results based on standard lithography methods.

[1] W. Fix, et al., APL 2002, Vol.81, p. 1735