Dresden 2003 – scientific programme
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TT: Tiefe Temperaturen
TT 20: Postersitzung IV (Mesoskopische Systeme, Supraleitung: Massivmaterialien, Bandleiter, Pinning, Vortexdynamik, Transporteigenschaften, Korngrenzen)
TT 20.21: Poster
Thursday, March 27, 2003, 14:30–19:00, P2c, P2d
Electron transport through single-walled carbon nanotubes encapsulated by metallic leads — •Daniel Secker, Ralph Krupke, and Heiko B. Weber — Forschungszentrum Karlsruhe, Institut für Nanotechnologie, Postfach 3640, D-76021 Karlsruhe
A combination of dielectrophoresis and shadow evaporation has been used to encapsulate the ends of single-walled carbon nanotubes (SWNT) by metallic leads. For the shadow evaporation of the metallic leads a mask of Si3N4 was prepared by standard e-beam lithography on a PMMA/Si3N4/SiO2/Si substrate using successive etch steps with SF6 and HF [1]. After the first shadow evaporation, SWNTs were selectively deposited from a DMF suspension between the contacts using alternating electric fields [2]. A second shadow evaporation step fully encapsulates the ends of the SWNTs by the metallic leads. This protocol avoids any exposure of the SWNTs with organic substances in contrast to marker-assisted e-beam lithography. This technique has been developed to study the influence of the contacts and the chemical environments on the electric transport.
[1] T. Hoss et al., Microel. Engin. 46 (1999) 149-152.
[2] R. Krupke et al., Appl. Phys. A 76 (2003) 397-400.