Regensburg 2004 – wissenschaftliches Programm

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CPP: Chemische Physik und Polymerphysik

CPP 16: POSTER: Computational Physics, Complex Systems

CPP 16.24: Poster

Dienstag, 9. März 2004, 17:00–19:00, B

Debonding of pressure sensitive adhesives — •E. Maurer¹, S. Loi¹, E. Bauer¹, T. Mehaddene¹, S. Cunis², and P. Müller-Buschbaum¹ — ¹TU München Physik Department LS E13, James-Franck-Str.1, 85747 Garching — ²HASLYAB, Notkestr. 85, 22607 Hambung

important class in adhesive technology. Typical examples in daily life are adhesive stickers, Scotch tape or stick-on notes. Symptomatic for this kind of adhesives is the dependence of adhesions quality on the bonding history. Important parameters are contact pressure and contact time. In most applications of PSA later a controlled debonding of the glued devices is desired. Despite high technological relevance, the physical mechanism of adhesion are still not fully understood. In addition the function of the fibrils appearing during debonding is not sufficiently clear. A macroscopic understanding of adhesion is provided by the so called tack test. A cylindrical punch is pressed under defined conditions (contact force, contact time) onto an adhesive film. While redrawing the punch with a constant velocity the force is measured. A microscopic investigation of the adhesion can be achieved by a scattering experiment during the tack test. We applied small angle x-ray scattering (SAXS). The combination of both, macroscopic mechanical data and microscopic information, is a promising attempt on the way to a detailed understanding of the mechanism underlying adhesion.