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DS: Dünne Schichten
DS 22: Postersitzung
DS 22.31: Poster
Dienstag, 9. März 2004, 14:30–17:00, Poster B
Evolution of stress in sputtered-deposited cobalt and copper thin films — •Mirela Pletea1, Winfried Brückner1, Horst Wendrock1, Rainer Kaltofen1, and Claus M. Schneider2 — 1Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden, PF 270116, D-01171 Dresden — 2Institute of Electronic Properties, Department of Solid State Research, Research Center Jülich, D-52425 Jülich
In order to study the stress development during sputter deposition of the magnetic multilayers we redesigned and reconstructed the dedicated set-up for in-situ stress measurements of single thin films. This novel set-up is able to monitor the stress development during sequential sputter deposition of two materials and to simultaneously control the substrate temperature. In this paper we present the first results from in-situ stress measurements using this new set-up during and after growth of Co and Cu single thin films with different thickness and sputtered under various sputtering conditions. The first results reveal: (i) an increasing of tensile stress and (ii) a tensile-compressive-tensile stress evolution during deposition under the same sputtering conditions of Co and Cu thin films, respectively. A special attention is paid on the stress evolution and growth processes of Cu and Co single thin films during the early stage of deposition. In order to find the mechanisms responsible for stress generation and relaxation in Co and Cu thin films, microstructure investigations performed by SEM, EBSD and AFM in combination with plasma diagnostics are carried out.