Regensburg 2004 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Downloads | Hilfe

O: Oberflächenphysik

O 28: Postersitzung (Elektronische Struktur, Grenzfläche fest-flüssig, Halbleiteroberflächen und -grenzflächen, Magnetismus und Symposium SYXM, Methodisches, Nanostrukturen, Oberflächenreaktionen, Teilchen und Cluster, Zeitaufgelöste Spektroskopie)

O 28.17: Poster

Mittwoch, 10. März 2004, 16:00–19:00, Bereich C

Copper sulfidation at the solid/liquid interface — •A. Spänig, T. Mangen, P. Broekmann und K. Wandelt — Institut für Physikalische Chemie; Wegelerstr. 12; 53115 Bonn

The initial stage of the sulfidation process of a Cu(100) electrode surface has been studied under electrochemical conditions by means of in-situ Scanning Tunneling Microscopy (STM). At negative electrode potential sulfide anions form a regular c(2 × 6) adsorbate layer which transforms irreversibly into two-dimensional copper sulfide phases at more positive potentials. Depending on the applied electrode potential different sulfide induced reconstruction phases could be generated which can be seen as precursor phases for the formation of bulk copper sulfide. The reconstruction process is accompanied by a massive mass transport out of the topmost copper layer pointing to a sulfide induced expansion of the topmost substrate layer.