Berlin 2005 – wissenschaftliches Programm

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DS: Dünne Schichten

DS 23: Postersitzung I

DS 23.12: Poster

Freitag, 4. März 2005, 16:00–18:30, Poster TU B

Stress evolution during and after sputter deposition of Cu/Co bi-layers — •Mirela Pletea, Winfried Brückner, Horst Wendrock, and Rainer Kaltofen — Leibniz-Institute for Solid State and Materials Research Dresden, P.O.Box 270116, D-01171 Dresden

The stress evolution during and after growth of Cu/Co bi-layers sputtered onto Si (100) substrates as a function of the individual layer thickness is reported. The stress was determined by means of in-situ wafer curvature measurements using a novel set-up based on the optical two-beam deflection method. Our earlier investigations and literature results showed that a transition from hcp to fcc structure of Co layers takes place with decreasing Co layer thickness and with the growth of Co on (fcc) Cu thin film. Therefore, we investigate (i) the stress evolution at Cu/Co interface with the change of the structure of Co layer with different thicknesses (between 5 and 100 nm) and (ii) the effect of the underlayer thickness on the stress evolution and microstructure state of Cu/Co bi-layers. The stress evolution of Cu and Co single thin films with different thicknesses is also investigated, for comparison. In order to correlate the microstructure development and stress evolution as a function of the individual layer thickness, microstructure investigations performed by XRD, SEM, EBSD and AFM are carried out.

This work was supported by DFG (Project SCHN 353/15-2).