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Q: Quantenoptik und Photonik

Q 26: Poster Wellenleitung & Informationsübertragung

Q 26.2: Poster

Montag, 7. März 2005, 11:00–12:30, Poster HU

Simulation of various 3D silicon taper structures for optical fibre to chip connection — •Roman Holly and Kurt Hingerl — Christian Doppler Laboratory of Surface Optics, Johannes Kepler Universität Linz, Altenberger Straße 69, A-4040 Linz, Austria

The use of high index contrast waveguides and devices is the key to successful development and fabrication of photonic integrated circuits. Considering the widespread use of silicon technologies and the suitable optical properties of silicon, this material is one of the best candidates for such devices. In order to exploit the full potential of silicon photonic devices we require an efficient way of coupling light from fibres to integrated photonic circuits.

We present the simulation results of various 3D silicon taper structures for optical fibre to chip connection. The tapers have been designed to fulfil the optical transmission criteria with focus on the polarisation-dependency problem by taking into account also their possible fabrication on SOI substrates. All the simulations have been conducted using BPM (beam propagation method) as well as FDTD (finite difference time domain) method. The review of the simulated characteristics and comparison between the different structures are presented. Furthermore, various possibilities of silicon 3D taper fabrication are discussed.