Dresden 2006 – wissenschaftliches Programm
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O: Oberflächenphysik
O 29: Poster session II (Nanostructures, Magnetism, Particles and clusters, Scanning probe techniques, Time-resolved spectroscopy, Structure and dynamics, Semiconductor surfaces and interfaces, Oxides and insulators, Solid-liquid interfaces)
O 29.12: Poster
Mittwoch, 29. März 2006, 14:30–17:30, P2
Electrochemically Fabricated Nanoscale Copper Wires: Investigation of Wire Morphology and Composition — •Thomas Koch1,2, Sheng Zhong1,2, Eberhard Nold3, Torsten Scherer2, Harald Roesner2, Horst Hahn2, Stefan Walheim2, Mu Wang4, and Thomas Schimmel1,2 — 1Institute of Applied Physics, University of Karlsruhe, D-76128 Karlsruhe, Germany — 2Institute of Nanotechnology (INT), Forschungszentrum Karlsruhe, D-76021 Karlsruhe, Germany — 3Institute for Materials Research I (IMF I), Forschungszentrum Karlsruhe, D-76021 Karlsruhe, Germany — 4National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing 21009, China
Metallic nanostructures, especially made from copper, have attracted considerable attention in recent years due to their potential use both as interconnects and as components for future generations of electronics. Here we report on the investigation of electrochemically self-assembled copper wires by SEM, TEM and SAMS. The wires were found to be straight, regular, without branches and more than 100 micrometer long. These wires align spontaneously to form ordered arrays, covering the insulated substrate in large numbers. The thickness of the wires can be controlled by the experimental parameters down to 120 nm. The SAMS results show that the investigated stable structures consist of pure copper. The TEM results point out that the wires consist of stacked single crystalline copper lamellae, which have a thickness of down to a few monolayers. The SAMS depth profiles show that the wires are surrounded by an oxide layer with a thickness of less than 15 nm.