Regensburg 2007 – wissenschaftliches Programm

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MM: Fachverband Metall- und Materialphysik

MM 14: SYM Micro- and Nanomechanics II

MM 14.2: Vortrag

Dienstag, 27. März 2007, 10:45–11:15, H16

Scaling in the mechanical properties of thin metal films: from the micro- to the nanoscale — •Ralph Spolenak — ETH Zurich, Zurich, Switzerland

It is well established that the yield stress of thin metal films inversely scales with film thickness as the micron length scale is approached. For thinner films, however, the scaling law changes and also other mechanical properties such as fracture toughness and modulus become affected by the reduced dimensions. Case studies will be presented for thin Cu, Au and Ta films in the thickness range from 10 to 3000 nm on polyimide substrates. Stress-strain curves are obtained by synchrotron based X-ray techniques. The scaling in fracture toughness and yield stress is critically discussed. In addition the effect of temperature on yield stress will be analyzed. In conclusion, thinner is not always better, but an optimal length scale can be found for nanoscale metals.