Regensburg 2007 – wissenschaftliches Programm
Bereiche | Tage | Auswahl | Suche | Downloads | Hilfe
MM: Fachverband Metall- und Materialphysik
MM 20: Poster session
MM 20.8: Poster
Dienstag, 27. März 2007, 14:45–18:00, Poster C
Interface Design for adhesion between NiTi shape memory alloy and Polyamide 6 — Stephane Youcheu Kemtchou1, Guido Grundmeier2, •Klaus Neuking1, and Gunther Eggeler1 — 1Lehrstuhl Werkstoffwissenschaft, Ruhr-Universität Bochum — 2Lehrstuhl Technische und Makromolekulare Chemie, Universität Paderborn
Composite Materials consisting of NiTi shape memory alloys as fiber and polymer as matrix have been studied in previous years due to their interesting properties for various applications like vibration control or as actuator. Because of their beneficial properties, especially better adherence to NiTi than thermoplastic polymers, elastomer and thermoset polymers such as epoxy were mostly used as polymer matrix. The aim of the present work was to study different interface systems including organo-functional silane to promote adhesion between NiTi and thermoplastic polymers. A pseudo elastic NiTi alloy and Polyamide 6 as thermoplastic matrix were used for this purpose. The sample was manufactured by injection moulding using in-mould assembly method. Pull- out tests were performed to study the change in adhesion relating to the interface used. The obtained results show significant increase in adhesion related to the interface system used.