Regensburg 2007 – wissenschaftliches Programm

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SYSE: Symposium Strain-Engineering for New Functional Structures

SYSE 1: Strain engineering in semiconductors

SYSE 1.2: Vortrag

Montag, 26. März 2007, 15:00–15:15, H1

Wrinkled semiconductor layers: from principle to applications — •Yongfeng Mei, Dominic J. Thurmer, Francesca Cavallo, Suwit Kiravittaya, Mohamed Benyoucef, Christoph Deneke, Tim Zander, Armando Rastelli, and Oliver G. Schmidt — Max-Planck-Institut für Festkörperforschung, Heisenbergstrasse 1, D-70569 Stuttgart, Germany

The wrinkling of thin films on substrate surfaces is a well-known phenomenon. A few potential applications of wrinkles have been put forward such as force spectroscopy in cells and metrology methods [1,2]. In this talk, we present a deterministic layer wrinkling method to fabricate ordered nanochannel networks on semiconductor substrates. The method, termed "Release and bond-back of layers (REBOLA)", consists of the partial release, wrinkling and bond back of a compressively strained functional layer on a Si-on-insulator substrate surface, which seems compatible with main stream Si technology. The layer deformation after deterministic wrinkling and bond-back is reflected by the band-edge shifts of an embedded quantum well structure, which we can describe accurately by theory. To elucidate the usefulness of REBOLA, we demonstrate nanofluidic transport as well as femto-litre filling and emptying of individual wrinkles on a standard semiconductor substrate. Some interesting phenomena related to wrinkling (like self-similar folding and interference-enhanced emission) will also be addressed. Support: BMBF(03N8711). [1] A. K. Harris et al. Science 1980, 208, 177; [2] C. M. Stafford et al. Nat. Mater. 2004, 3, 545.