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CPP: Fachverband Chemische Physik und Polymerphysik

CPP 21: POSTERS Colloids, Nanoparticles and Aggregates

CPP 21.24: Poster

Mittwoch, 27. Februar 2008, 16:00–18:30, Poster A

Plasma Electrochemistry in Ionic Liquids: Deposition of Copper-Nanoparticles — •Mareike Brettholle¹, Oliver Höfft¹, Sebastian Mathes², Sherif Zein El Abedin¹, and Frank Endres¹ — ¹Institut für Metallurgie, TU Clausthal, 38678 Clausthal-Zellerfeld, Germany — ²Institut für Physik und Physikalische Technologien, TU Clausthal, 38678 Clausthal-Zellerfeld, Germany

Ionic liquids are a highly interesting group of solvents for electrochemical processes - mainly due to the combination of their high electrical conductivity, their electrochemical stability and their ability to dissolve a wide range of compounds [1]. Due to their low vapour pressure low pressure plasmas can easily be applied. The idea is to use the free electrons of the plasma to reduce the dissolved metal atoms in the liquid and generate this way the metal particles. In ionic liquids this principle was utilized recently by Meiss et al. [2]. Here we present our results using an argon plasma as electrode for the electrochemical deposition of copper nanoparticles (5-100 nm) from a Cu solution in 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide [BMP]Tf2N and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide [EMIm]Tf2N. XPS, REM, EDX and Dynamic light scattering (DLS) were used to characterise the particles. [1] F. Endres, S. Zein El Abedin , Phys. Chem. Chem. Phys., 8 (2006) 2101; [2] S. A. Meiss, M. Rohnke, L. Kienle, S. Zein El Abedin, F. Endres and Jürgen Janek, Chem. Phys. Chem., 8 (2007) 50