Berlin 2008 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 13: Optical Layers: Basic Research and Applications

DS 13.1: Hauptvortrag

Dienstag, 26. Februar 2008, 09:30–10:15, H 2032

Film Production Technologies — •Hans K. Pulker — Thin Film Technology, Institute of Ion Physics and Applied Physics, University of Innsbruck, Austria

Films of elements, alloys, composites, and chemical compounds can be formed on solid substrates by various wet and dry chemical and physical deposition technologies. Depending on the applied technique, depositions are performed on air or in environmentally controlled atmosphere, under reduced gas pressure or in vacuum. In this paper mainly physical vapour deposition (PVD) processes are considered, because they are the preferred technologies for film deposition in optics. Chemical vapour deposition (CVD) and wet chemical processes are important in only few variants for this purpose. PVD processes are performed under vacuum and are based principally on purely physical effects. Intentionally forced chemical reactions by adding reactive gas to the coating chamber are used to deposit stoichiometric chemical compound films in the reactive deposition process. The chemical reactivity is generally positively influenced by the presence of a gas discharge plasma. In modern ion and plasma processes, input of energy into the growing film by collision and momentum transfer of kinetically enhanced ions, atoms and molecules causes densification and improves besides optical quality also structural and mechanical film properties and environmental stability. All the processes are used to deposit coatings in the thickness range between few nanometers up to some microns. Single films or multilayers can be deposited homogeneously or with graded composition.