Berlin 2008 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 31: Mechanical Properties III

MM 31.4: Talk

Wednesday, February 27, 2008, 18:15–18:30, H 0111

Mechanical properties of Pb-free solder-joints — •Jan Keller¹, Guido Schmitz¹, and Ulrich Wilke² — ¹Institut für Materialphysik, WWU Münster, Wilhelm-Klemm-Str.10, 48149 Münster, Germany — ²Infineon Technologies AG, Max-Planck-Str. 5, 59581 Warstein, Germany

After the prohibition of lead the main focus in packaging technology is to improve the performance of electronic devices. A critical issue is the mechanically stability. From the new relevant lead free solders regarding melting point and wettability, one has to figure out the composition with the best mechanically properties. In this work, we investigate the mechanical strength of Sn_xAg_yCu_z-solder between Cu-substrates with different contents of Ag and Cu in Sn. After soldering reactions under reducing atmosphere the solder joints are sheared and stress-strain curves are recorded. Mechanically loaded and unloaded specimens are observed by optical and scanning electron microscopy to determine the fracture structure and the reasons for the failure. The maximum strength, fracture toughness and elongation are related to the observed microstructure.(supported by Infineon Technologies AG)