Berlin 2008 – scientific programme

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TT: Fachverband Tiefe Temperaturen

TT 22: Transport: Poster Session

TT 22.18: Poster

Wednesday, February 27, 2008, 14:00–18:00, Poster B

Fabrication of sub-µm Nb/Al-AlO_x/Nb Josephson Junctions with Electron Beam Lithography for Qubit Applications — •Christoph Kaiser, Konstantin Il’in, and Michael Siegel — Institut für Mikro- und Nanoelektronische Systeme, Universität Karlsruhe (TH), D-76187 Karlsruhe

We fabricated sub-µm Josephson Junctions in Nb/Al-AlO_x/Nb trilayer technology. The shape of the junctions was defined by electron beam lithography and reactive ion etching. The junctions were electrically insulated by a layer of anodically oxidized Niobium as well as a SiO layer. The SiO film was deposited in a lift off process via thermal evaporation and its contact windows were also defined by electron beam lithography. Samples with different critical current densities were characterized at low temperatures in order to examine their suitability for qubit experiments.