Darmstadt 2008 – scientific programme

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P: Fachverband Plasmaphysik

P II: Poster: Niedertemperaturplasmen, Plasmatechnologie

P II.21: Poster

Tuesday, March 11, 2008, 11:00–13:00, Poster C3

Plasma-deposition of low stress a-Si:H/a-C:H multi-layers — •Azadeh Hosseini Badakhshani, Janine Schauer, Benedikt Niermann, and Jörg Winter — Ruhr - Universität Bochum, Institut für Experimentalphysik II,Universitätsstraße 150,Gebäude NB,44801 Bochum

Because of its hardness and wear resistance diamond-like carbon (DLC) has the desired properties of a good protective coating. But these films possess high intrinsic stresses which can lead to film delamination especially when thick DLC films are considered. It has been shown that the adhesion of DLC can be improved by depositing a thin interlayer of amorphous-hydrogenated silicon (a-Si:H) between DLC film and substrate. In this work properties of multi-layers of a-Si:H and DLC have been studied. Depositing thin layers of a-Si:H and DLC on each other enables depositing thick a-Si:H /DLC film systems with low intrinsic stress. These multi-layers have been deposited via PECVD. The behaviour of intrinsic stresses in muli-layers with varying thickness has been investigated. Fatigue properties of these films deposited on nickel titanium have been qualitatively tested by cavitation erosion admission. In this test the substrate comes to contact with periodical shock waves produced in water.