Dresden 2009 – wissenschaftliches Programm
Bereiche | Tage | Auswahl | Suche | Downloads | Hilfe
CPP: Fachverband Chemische Physik und Polymerphysik
CPP 26: Organic Photovoltaics I
CPP 26.4: Vortrag
Mittwoch, 25. März 2009, 14:45–15:00, ZEU 222
Interfacial adhesion in polymer blend P3HT:PCBM solar cells — •Ayse Turak1, Jonas Hanisch2, Esther Barrena1,3, Erik Ahlswede2, and Helmut Dosch1,3 — 1Max Planck Institute for Metals Research, Heisenbergstrasse 3, 70569, Stuttgart — 2Zentrum für Sonnenenergie- und Wasserstoff-Forschung (ZSW) Baden-Württemberg, Industriestrasse 6, 70565, Stuttgart — 3Institut für Theoretische und Angewandte Physik, Universität Stuttgart, Pfaffenwaldring 57/VI, 70550 Stuttgart, Germany
The nature of the contact at the electrode/organic interface has a major impact on device performance. Introduction of thin dielectric interlayers such as LiF have been successful in significantly improving device properties. However, examination of the buried interface is generally difficult as deposition of the top electrode may alter the nature of the contact. Using peel-off adhesion analysis with grazing incidence x-ray diffraction, atomic force microscopy and optical imaging, we have assessed the quality of the buried interfacial layer in P3HT:PCBM solar cells in the presence of interlayers. We see increased adhesion of the Al cathode without the interlayer, suggesting broader interfacial mixing of the Al with the polymer without LiF as a blocking interlayer. The confinement of the charge extraction to a well defined interface may be used to explain improved device performance with LiF interlayers.