Dresden 2009 – scientific programme
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DS: Fachverband Dünne Schichten
DS 26: Poster II
DS 26.47: Poster
Wednesday, March 25, 2009, 09:30–12:30, P5
Effect of annealing on surface morphology and mechanical properties on electroplated copper thin films — •Anastasia Moskvinova1, Olena Chukhrai1, Michael Hietschold1, Inna Schuebert2, and Ramona Ecke2 — 1Institute of Physics, TU Chemnitz , Germany — 2Center for Microtechnologies, TU Chemnitz, Germany
The annealing influences on the morphological and mechanical properties in a copper interconnect layer deposited by electroplating (EP) were investigated. EP Cu films show a microstructural transformation at room temperature, known as self-annealing. That leads to the texture changes due to the recrystallization. The 500nm EP Cu films were deposited on the seed Cu(100nm)/TiN(20nm)/SiO2/Si(100). Local mechanical properties were measured by nanoindentation. It was found that yield strengths of ECD Cu films are 500-600MPa. Microstructural evolution during self-annealing and annealing at different temperatures of copper thin films were investigated by electron backscattered diffraction (EBSD). Changes of the crystallographic texture of ECD Cu films were observed as a consequence of multiple twinning during self-annealing and annealing at different temperatures. It was found that texture formations depend strongly on the annealing temperatures. Increasing temperature leads to decreased sheet resistance and increased grain size and randomly oriented grains.