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DS: Fachverband Dünne Schichten
DS 3: Layer Deposition Processes
DS 3.1: Vortrag
Montag, 23. März 2009, 15:45–16:00, GER 37
Growth of carbon nanotubes on different support/catalyst systems for interconnect and sensor applications — •Sascha Hermann1, Ramona Ecke1, Barbara Pahl2, and Stefan E. Schulz1,3 — 1Chemnitz University of Technology, Center for Microtechnologies, 09126 Chemnitz, Germany — 2Fraunhofer Institute for Reliability and Microintegration, 13355 Berlin, Germany — 3Fraunhofer ENAS for Electronic Nanosystems, 09126 Chemnitz, Germany
This work is focused on the growth of aligned densely packed multi walled carbon nanotubes (MWNT) for the application as Via-interconnects. We have conducted a parametric study on different support/catalyst systems and investigated its influence on CNT growth performed with thermal CVD. Basic studies with the support/catalyst combination SiO2/ Ni were conducted to study the influence of gas composition, temperature and catalyst thickness. Furthermore, we have prepared bi-catalytic systems like NiMo and CoMo and investigated its influence on catalyst effectiveness and CNT growth temperature. As a step towards integration, we have prepared patterned substrates with a complete metallization system including a Cu/TiN/Ni layer stack. We have achieved selective growth of densely packed vertical aligned MWNTs. Electrical measurements of flip-chip connections indicate good electrical properties of the CNT-arrays.