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O: Fachverband Oberflächenphysik

O 39: Metal substrates: Solid-liquid interfaces

O 39.8: Vortrag

Mittwoch, 25. März 2009, 16:45–17:00, SCH A315

The influence of additives on the Cu(001)/electrolyte interface — Yvonne Gründer, •Arne Drünkler, Frederik Golks, Daniel Kaminski, Klaus Krug, Jochim Stettner, and Olaf M. Magnussen — Christian-Albrechts-Universität Kiel, Germany

Copper electrodeposition from multicomponent electrolytes containing organic additives is an important process for the defect-free filling of trenches on ultra large scale integrated (ULSI) microchips [1]. In these electrolytes, polyethers, usually polyethylene glycol (PEG), in combination with chloride ions form an overlayer on Cu that inhibits the electrodeposition reaction [2]. Despite the numerous studies on Cu superconformal electrodeposition the precise influence of the additive on the elementary steps of this deposition reaction is largely not understood, mostly due to the difficulty in making direct experimental observations of the growth mechanisms on the atomic scale. In-situ Surface X-Ray Diffraction (SXRD) offers unique possibilities to study the electrochemical processes under the film and could provide first direct data on the atomic-scale growth mechanism under these conditions. SXRD experiments revealed on Cu(001) in PEG containing electrolyte the existence of an ordered Cl- adlayer underneath the inhibiting film. Moreover we found evidence for a pronounced kinetic limitation for the formation of this adlayer structure.

References: [1] P.C. Andricacos, et al., Electroch. Microf. 42, 567 (1998) [2] P.M. Vereecken, R.A. Binstead, H Deligianni, P.C. Andricacos, IBM J. Res. Develop. 49, 3 (2005)