Regensburg 2010 – scientific programme
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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 22: Biopolymers and Biomaterials (jointly with BP)
CPP 22.1: Topical Talk
Wednesday, March 24, 2010, 14:00–14:30, H37
Atomic Layer Deposition (ALD) as a Versatile Tool for Nanoscience — •Mato Knez1, Seung-Mo Lee1, Adriana Szeghalmi1, Yong Qin1, Eckhard Pippel1, Christian Dresbach2, and Gerd Hause3 — 1Max-Planck-Institute of Microstructure Physics, Halle, Germany — 2Fraunhofer Institute IWM, Halle, Germany — 3Martin-Luther-University, Halle-Wittenberg, Germany
Atomic layer deposition (ALD) is a thin film deposition technique which was developed in the 1970s to meet the needs for processing thin film electroluminescent displays (TFEL). Being a non-line-of-sight deposition technique, ALD allows for good coating conformality even with 3D nanostructured substrates or structures with a high aspect ratio together with a good capability for upscaling. An increasing number of researchers make use of the precision of ALD for fabrication or functionalization of nanostructures, optical coatings, catalytically active coatings, encapsulation, corrosion protection or even infiltration of soft materials with metals.
The most recently evolving application of ALD deals with the modification of mechanical properties of soft materials after infiltration of metals by ALD. Although the detailed chemistry behind the approach is not yet understood, biological materials, such as spider silk or collagen, can positively change their mechanical properties after being treated with pulsed vapors of metal precursors. The toughness of such materials increased by up to 10-fold, outperforming most manmade materials.