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Regensburg 2010 – scientific programme

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O: Fachverband Oberflächenphysik

O 59: Poster Session II (Nanostructures at surfaces: Dots, particles, clusters; Nanostructures at surfaces: arrays; Nanostructures at surfaces: Wires, tubes; Nanostructures at surfaces: Other; Plasmonics and nanooptics; Metal substrates: Epitaxy and growth; Metal substrates: Solid-liquid interfaces; Metal substrates: Adsoprtion of organic / bio molecules; Metal substrates: Adsoprtion of inorganic molecules; Metal substrates: Adsoprtion of O and/or H; Metal substrates: Clean surfaces; Density functional theory and beyond for real materials)

O 59.69: Poster

Wednesday, March 24, 2010, 17:45–20:30, Poster B1

Chemical Charaterization of Porphyrin Adsorbed on Anion Modified Copper Electrodes: An SXPS Study — •Stephan Breuer1, Knud Gentz1, Duc Thanh Pham1, Thanh Hai Phan1, Thomas Mayer2, Peter Broekmann3, and Klaus Wandelt11Universität Bonn, Institut für Physikalische und Theoretische Chemie, Wegelerstraße 12, D-53115 Bonn — 2Technische Universität Darmstadt, FB Materialwissenschaft, Petersenstraße 23, D-64284 Darmstadt — 3Universität Bern, Departement für Chemie und Biochemie, Freiestraße 23, CH-3012 Bern

Several Anions adsorb specifically from aqueous solution on copper electrodes. In case of copper single crystals, the electrode acts as a template for the anion adsorption and well ordered superstructures are observable. These, negatively charged, anion layers are used as secondary templates for the adsorption of cationic organic molecules.

The adsorption of TMPyP (Tetramethylpyridiniumporphyrin) has been extensively studied by in-situ EC-STM [1] which provides structural and electrochemical data, but there are less data about the chemical composition of the adsorbate layer. We have characterized (ex-situ) the chemical composition of the adsorbed TMPyP molecules on halide and sulfide modified Cu(100) and Cu(111) using XPS at the synchrotron radiation facility BESSY II.

[1] N.-T.M. Hai, B. Gasparovic, P. Broekmann, K. Wandelt, Surf. Sci. 601, 2007, 2597-2602.

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