Dresden 2011 – scientific programme
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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 11: Poster: New Instruments and Methods
CPP 11.12: Poster
Monday, March 14, 2011, 17:30–19:30, P2
The new beamline BL-1 at DELTA — •Thorsten Brenner, Daniela Lietz, Michael Paulus, Ulf Berges, Christian Sternemann, and Metin Tolan — Fakultät Physik/DELTA, TU Dortmund, 44221 Dortmund.
Deep x-ray lithography is a method to produce various microstructures with a height up to several millimeters. Structures with a lateral resolution up to 2 µm and a high aspect ratio of about 100 can be produced. A well-established process for production of microstructures using lithography is the LIGA process. A wafer covered with a photo sensitive material is exposed through a mask. This mask consists of an x-ray transparent material and an absorber material. The lateral shape of the absorber is transferred into the photoresist by shadow projection. After chemical development the exposed (pos.) or unexposed (neg. resist) material is removed. Afterwards, the micromechanical components can be produced by electroplating and molding.
In 2010 the construction of beamline BL-1 at DELTA has been finished. This beamline uses white radiation generated by a 1.5 T bending magnet (critical energy 2.2 keV). First lithography exposures of SU-8 covered silicon wafers at BL-1 were performed successfully. The exposure times have been between five and ten minutes yielding a deposited bottom dose of 15 to 25 J/cm3 (top to bottom dose ratio ≈ 5). SEM images of the developed wafers show high quality structures concerning the adhesion between resist and substrate, aspect ratio, and wall roughness. Systematic studies to find optimal exposure parameters are planned for 2011.