Dresden 2011 – scientific programme

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DS: Fachverband Dünne Schichten

DS 12: Layer Deposition Processes

DS 12.3: Talk

Monday, March 14, 2011, 17:45–18:00, GER 38

Deposition and growth of antibacterial Ti-Cu films — •Vitezslav Stranak¹, Harm Wulff¹, Steffen Drache¹, Robert Bogdanowicz¹, Zdenek Hubicka², Carmen Zietz³, Kathleen Arndt⁴, Rainer Bader³, Andreas Podbielski⁴, and Rainer Hippler¹ — ¹University of Greifswald, Institute of Physik, Felix-Hausdorff-Str. 6, 17489 Greifswald, Germany — ²Academy of Sciences of the Czech Rep., Institute of Physics, Na Slovance 2, 18221 Praha 8, Czech Republic — ³University of Rostock, Department of Orthopaedics, Doberaner Str. 142, 18057 Rostock, Germany — ⁴University of Rostock, Dept. of Med. Microbiol., Vir. and Hyg., Schillingallee 70, 18057 Rostock, Germany

Formation of Ti-Cu films prepared by advanced dual-magnetron sputtering techniques is presented. Three different methods of magnetron sputtering (dc, dual, and dual-HiPIMS) were employed to prepare intermetallic Ti-Cu films. Thin film properties were investigated by x-ray photoelectron spectroscopy and x-ray diagnostics. Preferential Cu crystallization is caused by a large density of Cu species in the discharge volume. The ion energy distribution in the substrate position (measured with a retarding field analyzer, RFA) corresponds with the crystallization process. The antimicrobial effect is caused by copper released from the Ti-Cu metallic structure; copper release was measured by atomic absorption spectroscopy. In vitro planktonic growth tests on Ti-Cu films prepared by dual-HiPIMS technique proved to kill bacteria efficiently.