Dresden 2011 – wissenschaftliches Programm
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MM: Fachverband Metall- und Materialphysik
MM 46: Mechanical Properties III
MM 46.2: Vortrag
Freitag, 18. März 2011, 10:45–11:00, IFW D
Influence of Microstructure on Thermo-Mechanical Fatigue of Al Thin Films on Substrates — •Walther Heinz1 and Gerhard Dehm1,2 — 1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben — 2Department Materials Physics, Montanuniversität Leoben, Austria
The difference in thermal expansion coefficient between Al and Si can cause interconnect failure by thermo-mechanical fatigue in microelectronic devices subjected to repeated thermal cycling. In this study the influence of grain orientation on damage evolution of 0.2 - 2μm thick Al films on Si and alumina substrates is analyzed by local electron backscattered diffraction in a scanning electron microscope. The films are cycled between 100°C and 450°C up to 10.000 times. The investigations reveal that texture is a route to avoid thermo-mechanical fatigue damage by selecting a sharp (111) fibre texture. This can be explained by orientation dependent plasticity.