Dresden 2011 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 46: Mechanical Properties III

MM 46.3: Talk

Friday, March 18, 2011, 11:00–11:15, IFW D

Low cycle fatigue of lead free solder joints — •Lars Schemmann, Andre Wedi, Dietmar Baither, and Guido Schmitz — Institut für Materialphysik, Westf. Wilhelms-Universität, Wilhelm-Klemm-Straße 10, 48149 Münster, Germany

Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony . This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.