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Q: Fachverband Quantenoptik und Photonik

Q 15: Poster 1: Quanteninformation, Quanteneffekte, Laserentwicklung, Laseranwendungen, Ultrakurze Pulse, Photonik

Q 15.3: Poster

Montag, 14. März 2011, 16:30–19:30, P1

Characterization of the laser-induced enhanced absorbance due to etching with LESAL — •Martin Erhhardt and Klaus Zimmer — Permoser Str. 15

High-quality etching of transparent materials for applications in micro- and nano-structuring as well as in precision engineering is still a challenge for current laser processing techniques. Laser Etching at a Surface-Adsorbed Layer (LESAL) is an advanced laser processing method applying a gaseous absorber at the backside of the processed sample. Material processing with the LESAL method is particularly characterized by a low etching rate (< 1 nm/pulse) and a very low surface roughness of down to 0.4 nm rms. In previous studies LESAL was investigated in terms of the influence of different laser parameters like fluence, wavelength, pulse duration, and pulse number on the etching rate and the achieved surface qualities. This work is addressed to study the laser-induced alterations of LESAL-processed fused silica surfaces by means by investigating the optical properties. For this purpose depth-resolved transmission measurements were done in the UV/Vis wavelength range of laser-etched areas. The results were correlated with the used laser parameters. The obtained results are of basic interest to reveal the etching mechanism, to clarify the role of the near-surface modification at LESAL and to provide input data for simulations of the LESAL process.