Berlin 2012 – scientific programme

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DS: Fachverband Dünne Schichten

DS 1: Layer properties: electrical, optical, and mechanical properties

DS 1.11: Talk

Monday, March 26, 2012, 12:00–12:15, H 0111

Simulation of electromigration effects on voids in monocrystalline Ag films — •Andreas Latz and Dietrich E. Wolf — Physics, University Duisburg-Essen, Duisburg, Deutschland

Due to the decreasing width and thickness of interconnects with each integrated circuit generation, electromigration phenomena in the different monocrystalline parts of the interconnects become of increasing interest. We investigate how voids penetrating a monocrystalline silver film are affected by electromigration. Based on the kinetic Monte Carlo method, we developed a three dimensional, atomistic simulation model that is fast enough to access the desired time scales to investigate electromigration phenomena on an atomistic scale. A clear dependency between the strongly facetted non-equilibrium shape of the voids and the crystallographic orientation of the film is found, which is in accordance with experimental results on bicrystalline silver wires. This work has been supported by German Science Foundation within SFB 616: Energy Dissipation at Surfaces.