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DS: Fachverband Dünne Schichten

DS 32: Thermoelectric materials I (Focused session – Organizers: Meyer, Heiliger)

DS 32.3: Topical Talk

Donnerstag, 29. März 2012, 10:30–11:00, H 2032

Investigations of the thermal conductivity of thermoelectric thin films and nanostructures — •Friedemann Voelklein, Heiko Reith, Matthias Schmitt, and Daniel Huzel — RheinMain University of Applied Sciences Wiesbaden, Germany

The characterization of the thermal transport properties of thin films and nanostructures is important both for understanding of their transport mechanisms and for their technical applications. Thermal conductivity and diffusivity are crucial material parameters for the design of integrated devices, MEMS, sensors and actuators. The coefficient of performance of thermoelectric devices such as generators, coolers and sensors can be improved by an increase of thermoelectric efficiency z. Considerable decreases of thermal conductivity (and increases of z) can be observed in nanostructured thermoelectric materials due to finite size effects. Thus, nanowires and nanoscale materials are promising candidates for new thermoelectric devices with significantly increased thermoelectric coefficients of performance. Measurements of thermal conductivities of thin films and nanostructures are associated with various experimental problems. We report on methods for the characterization of thermal conductivity by using diagnostic microchips with suspended thin films and nanowires. Results of thermal conductivity measurements on thermoelectric thin films and nanostructures are discussed using finite size effects models.