Berlin 2012 – scientific programme

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O: Fachverband Oberflächenphysik

O 57: Solid / liquid interfaces II

O 57.4: Talk

Wednesday, March 28, 2012, 17:30–17:45, A 060

EC-STM study of bulk Cu(1 1 1) and Cu covered Au(1 1 1) electrodes in a phosphate buffer solution — •Christian Schlaup and Sebastian Horch — Center for Individual Nanoparticle Functionality (CINF), Department of Physics, Technical University of Denmark (DTU), DK–2800 Kongens Lyngby, Denmark

Copper is known to have an outstanding catalytic activity for the electroreduction of carbon dioxide. For a deeper insight into the involved sites as well as their dynamics under reaction conditions well defined single crystalline copper surfaces can be used as an adequate model system.

In a first step the fundamental interaction of both, a bulk Cu(1 1 1) surface and a laterally expanded Cu surface, i.e. an ultrathin Cu film on a Au(1 1 1) electrode, in contact with neutral phosphate buffer electrolyte has been studied using in-situ STM. Thereby, depended on the actual sample treatment, several phases, e.g. phosphate adsorbate or copper oxide film, were found and characterized.