Berlin 2012 – scientific programme

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SYRS: Symposium Resistive Switching

SYRS 2: Poster: Resistive switching (jointly organized by DS, DF, KR, HL)

SYRS 2.37: Poster

Thursday, March 29, 2012, 17:30–19:00, Poster E

Deep X-Ray Lithography at DELTA — •Thorsten Brenner, Daniela Lietz, Michael Paulus, Christian Sternemann, and Metin Tolan — Technische Universität Dortmund/DELTA, 44221 Dortmund, Germany

DELTA (Dortmund, Germany) is a synchrotron light source with a electron energy of 1.5   GeV and a maximum current of 130   mA. DELTA beamline BL-1 is dedicated to deep x-ray lithography (DXRL). DXRL is a method to produce various microstructures with a height up to several millimeters. Microstructures are applied in optics, micro mechanics, fluidic, or medical devices. It is possible to reach a high aspect ratio of about 100 and a lateral resolution up to 2   µ m for microstructures using DXRL [1]. A well-established process for production of microstructures using lithography is the LIGA process. It includes the process steps (xray) lithography, electroplating, and molding. The aim is to produce microparts with high quality. For that reason silicon wafers with SU-8 photoresist are exposed and chemically developed. Here, process parameters (x-ray spectrum, mask types, dose, post exposure bake) are tuned for optimization of exposure process. SEM images are made to determine aspect ratio, roughness of surfaces and walls and adhesion between substrate and resist. Furthermore, a new endstation for BL-1 at DELTA is under construction. Here, improvements for the exposure process are of central interest.

[1] V. Saile, U. Wallrabe, O. Tabata, J.G. Korvink, O. Brand, G.K. Fedder, C. Hierold (Eds.):, LIGA and its applications, Wiley-VCH (2009).