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MM: Fachverband Metall- und Materialphysik
MM 20: Transport & Diffusion I
MM 20.4: Vortrag
Dienstag, 12. März 2013, 11:00–11:15, H26
Solute diffusion along interfaces in nanocrystalline copper — •Matthias Wegner1, Jörn Leuthold1, Martin Peterlechner1, Xiaoyan Song2, Sergiy Divinski1, and Gerhard Wilde1 — 1University of Münster, Institute of Materials Physics, Wilhelm-Klemm-Straße 10, 48149 Münster, Germany — 2Beijing University of Technology, 100124 Beijing, China
Diffusion of solutes along interfaces in nanocrystalline copper with grain sizes of about 40 and 50 nm produced by Spark Plasma Sintering (SPS) is investigated by means of the radiotracer technique. The small grain size in addition to the good thermal stability of SPS Cu yields a unique opportunity to measure radiotracer diffusion in a nanocrystalline material without complicating effects like grain boundary motion, grain growth or recrystallization. Diffusion measurements were done within the temperature regime of 435 K up to 470 K. The results are discussed with respect to a potential influence of triple junction diffusion on the measured diffusion profiles. Possible mechanisms which may be responsible for stabilizing the microstructure of the nanocrystalline copper up to temperatures of ~ 1/3 of the melting temperature are elucidated. Furthermore the amount of porosity and its effect on the measurements is discussed. As a main result, the absence of a size dependence of the specific grain boundary diffusion rate is observed.