Regensburg 2013 – scientific programme
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MM: Fachverband Metall- und Materialphysik
MM 37: Mechanical Properties I
MM 37.3: Talk
Wednesday, March 13, 2013, 12:15–12:30, H26
Kinetic processes in copper bi- and tricrystals — •Isabelle Binkowski1, Jörn Leuthold1, Matthias Wegner1, Martin Peterlechner1, Shashank Shekhar2, Alex King2, Sergiy Divinski1, and Gerhard Wilde1 — 1Institut für Materialphysik, Universität Münster, Wilhelm-Klemm-Str. 10, D-48149 Münster, Germany — 2School of Materials Engineering, Purdue University, 501 Northwestern Avenue, West Lafayette, IN 47907-2044, USA
Grain boundaries (GBs) and their junctions often define properties of polycrystalline materials and have a dramatic influence on diffusion and plastic behavior. Owing to the high density of grain boundaries included in polycrystalline materials and especially nanocrystalline materials, investigation of kinetic processes in this type of defect are of fundamental interest. Heading towards nanostructured materials one has to focus also on triple junctions (TJs) since their volume fraction and thus their influence on materials' properties rise. In the present investigation, a near special Σ5:Σ5:Σ25 copper tricrystal is utilized for examining the properties of a triple junction with defined orientations of grains and defined misorientations across the grain boundaries. The mass transport properties of the tricrystal are investigated using the radiotracer method with the 110mAg isotope. The kinetics of out-diffusion from the triple junction into the neighboring grain boundaries are carefully measured by preparing proper bicrystal samples. Additionally, tensile tests including plastic deformation of several percent are performed and the digital image correlation technique is applied to measure the strain fields in the immediate vicinity of GBs and TJs.