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O: Fachverband Oberflächenphysik
O 44: Scanning Probe Methods I
O 44.6: Vortrag
Mittwoch, 13. März 2013, 11:45–12:00, H33
Conductive AFM for characterization of MW-CNT-based via interconnect systems — •Marius Toader1, Holger Fiedler2, Sascha Hermann2, Stefan E. Schulz2,3, Thomas Gessner2,3, and Michael Hietschold1 — 1Chemnitz University of Technology, Institute of Physics, Solid Surfaces Analysis Group, D-09107 Chemnitz, Germany — 2Chemnitz University of Technology, Center for Microtechnologies, D-09126 Chemnitz, Germany — 3Fraunhofer Institute for Electronic Nano Systems (ENAS), D-09126 Chemnitz, Germany
Advanced hybrid interconnects where copper will be replaced using carbon nanotubes (CNTs) will represent the breakthrough in overcoming the actual limitations of interconnect industry strongly constrained by the shrinking issues. To successfully proceed with the development and improvement of such systems, a comprehensive understanding is required and therefore a detailed characterization should be addressed. We report on and emphasize the versatility of conductive AFM (c-AFM) in characterizing vertically aligned CNTs aimed to be used in via interconnect technology. The study is conducted on multi-walled CNT (MW-CNT) arrays vertically grown on a copper-based metal line [1]. The advantages of the c-AFM with respect to the classical electrical measurements are discussed. A detailed insight into the internal performance is achieved via current-voltage spectroscopy. [1] Fiedler H, Toader M, Hermann S, Rodriguez R, Sheremet E, Rennau M, Schulze S, Waechtler T, Hietschold M, Zahn D, Schulz S, Gessner T: ECS Journal of Solid State Science and Technology 2012, 1(6) M47-M51.