Dresden 2014 – wissenschaftliches Programm
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DS: Fachverband Dünne Schichten
DS 35: Poster I: Application of thin films; Focus session: Sensoric micro and nano-systems; Focus Session: Sustainable photovoltaics with earth abundant materials; Graphen (joint session with TT; MA; HL; DY; O); Ion and electron beam induced processes; Layer properties: electrical, optical, and mechanical properties; Magnetic/organic interfaces, spins in organics and molecular magnetism; Micro- and nanopatterning (jointly with O); Organic electronics and photovoltaics (jointly with CPP, HL, O); Thermoelectric materials
DS 35.22: Poster
Mittwoch, 2. April 2014, 17:00–20:00, P1
MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method — •Christian Helke1, Tom Enderlein1, Stefan M. Harazim2, Jörg Nestler1, Oliver G. Schmidt2, Thomas Otto3, and Thomas Gessner1,3 — 1TU Chemnitz, Zentrum für Mikrotechnologien, Reichenhainer Str. 70, 09126 Chemnitz, Germany — 2IFW Dresden, Helmholtzstraße 20, 01069 Dresden, Germany — 3Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz, Germany
In contrast to conventional laboratory based analysis methods Lab-on-a-Chip (LoC) systems reveal their advantage of performing complex bio-assays on very limited space right at the point of care. To fulfill these laboratory steps in a LoC system all necessary steps from sample preparation until evaluation have to be integrated within this smart system. For this approach rolled-up sensor elements based on the method of *rolled-up nanotech* have to be integrated. The possible integration techniques are limited regarding the sensor elements itself (architecture, material layer system and properties), the feasible functionalization on the inside wall of the sensor elements and the wafer level integration approach, which is aimed. Therefore a *dry* integration technique is favored, because of its not influencing of the inside wall functionalization and the aimed realizing at wafer level with standard CMOS microtechnologies. This system consists out of lithographically manufactured negative photoresist SU8 multilayered structures with microfluidic and integration layers for the rolled-up sensor elements.