Dresden 2014 – wissenschaftliches Programm
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DS: Fachverband Dünne Schichten
DS 35: Poster I: Application of thin films; Focus session: Sensoric micro and nano-systems; Focus Session: Sustainable photovoltaics with earth abundant materials; Graphen (joint session with TT; MA; HL; DY; O); Ion and electron beam induced processes; Layer properties: electrical, optical, and mechanical properties; Magnetic/organic interfaces, spins in organics and molecular magnetism; Micro- and nanopatterning (jointly with O); Organic electronics and photovoltaics (jointly with CPP, HL, O); Thermoelectric materials
DS 35.50: Poster
Mittwoch, 2. April 2014, 17:00–20:00, P1
Fabrication of sub-microstructures in solid copper surfaces by inverse laser microembossing — •Martin Ehrhardt, Pierre Lorenz, and Klaus Zimmer — Leibniz-Institut für Oberflächenmodifizierung e. V., Permoserstraße 15, 04318 Leipzig, Germany
Both the ongoing miniaturization and integration of microdevices and the increasing complexity of microelectromechanical systems (MEMS) call for new machining and fabrication techniques. Laser microembossing is a manufacturing technology which enables the direct fabrication of three-dimensional microstructures in metal foils by replication of a master surface. In the present study a laser embossing process is employed which overcomes the traditional limitation of laser processing. A KrF excimer laser (wavelength λ = 248 nm, pulse duration tpulse = 25 ns) was used to generate different kinds of 3D micro- and nanopatterns in metallic surfaces. The influence of the most important laser parameters on the embossing process with respect to the achieved quality of the generated surface pattern is presented. Therefore, the formed micro- and nanostructures were analyzed by scanning electron microscopy, atomic force microscopy, and white light interferometry. To investigate the material modification, e.g. defect formation and grain size changing due to the embossing process, cross section of the formed microstructures were analyzed by scanning electron microscopy.