Dresden 2014 – scientific programme

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MM: Fachverband Metall- und Materialphysik

MM 50: Mechanical properties III - Evolution & deformation of microstructure

MM 50.4: Talk

Thursday, April 3, 2014, 11:00–11:15, IFW B

Room temperature grain growth in polymer-supported Cu and Au films during fatigue loading — •Oleksandr Glushko and Megan Cordill — Erich Schmid Institute, Jahnstr 12, 8700 Leoben, Austria

In this contribution a systematic investigation of microstructural changes in polymer-supported Cu and Au films under tensile fatigue loading conditions is presented. Fatigue tests were performed under total strain control and electrical resistance of the films was measured in-situ during the test. To capture the changes in the grain structure due to fatigue the EBSD and FIB ion channeling techniques were applied to the same areas of the films once before and once after cyclic mechanical test. Using this approach significant grain coarsening was observed in e-beam evaporated 500 nm thick Cu and Au films on polyimide. The grain coarsening effect is also manifested by the decrease of film resistance during first 500-1500 cycles. Under certain conditions the grain coarsening in gold films leads to total recrystallization and grain sizes are increased by 400% already after 1000 cycles. The role of grain coarsening in initiation and propagation of fatigue damage is also discussed.