Dresden 2014 – scientific programme
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O: Fachverband Oberflächenphysik
O 59: Metal Substrates I
O 59.9: Talk
Wednesday, April 2, 2014, 18:00–18:15, WIL A317
STM and LEED studies on alloying and oxidation effects at the Mn/Cu(001) interface — •Jiaming Song1, Chii-Bin Wu2, and Wolfgang Kuch1 — 1Freie Universität Berlin, Institut für Experimentalphysik, Arnimallee 14, 14195 Berlin, Germany — 2Chung Yuan Christian University, Department of Physics, 200 Chung Pei Rd., Chung Li, Taiwan 32023, R.O.C.
Scanning tunneling microscopy (STM) and low-energy electron diffraction (LEED) are applied for characterizing the interface properties of Mn/Cu(001) at room temperature. STM reveals a three-dimensional growth mode of Mn on clean Cu(001). When a submonolayer Co is introduced in between, the Mn growth mode is stabilized in a two-dimensional mode. This two-dimensional growth mode can be attributed to the formation of an intermixed alloy of MnCo or even MnCoCu. Growth of Mn on the ``missing row'' phase of oxidized Cu(001) occurs without the surfactant effect known from the growth of Co, Ni and Fe on that surface. The absence of the surfactant effect of oxygen could be due to a larger binding energy between Mn and oxygen atoms compared to the surface energy. Nevertheless, the Mn growth mode on this oxidized Cu(001) surface is still two-dimensional. This might be due to a reduction of the surface energy of the substrate by the oxygen during the Mn growth, leading to a smoother morphology.