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DS: Fachverband Dünne Schichten

DS 22: Interfaces and Thin Films III (joint session with CPP)

DS 22.13: Vortrag

Mittwoch, 18. März 2015, 12:45–13:00, C 243

Deposition of copper multilayers on Au(111) in sulphuric acid solution: An electrochemical scanning tunneling microscopy study — •Bartosz Madry¹, Klaus Wandelt^1,2, and Marek Nowicki¹ — ¹Institute of Experimental Physics, University of Wroclaw, pl. M. Borna 9, 50-204 Wroclaw, Poland. — ²Institute of Physical and Theoretical Chemistry, University of Bonn, Wegelerstr. 12, 53115 Bonn, Germany.

The co-adsorption of submono-, mono- and multi-layers of Cu with sulfate anions on a Au(111) electrode surface was investigated in electrochemical environment (0.1 mM CuSO₄ + 0.1 M H₂SO₄) by cyclic voltammetry (CV) and in-situ scanning tunneling microscopy (STM). Correlated with the STM investigations the CV measurements indicate co-adsorption/-desorption processes of Cu of submono-, mono- and multi-layer coverages with sulfuric acid species on Au(111). The formation of a quasi-hexagonal Moiré superstructure on terraces of copper multilayers was observed in situ by STM. In detail the observed Moiré-structure is similar but not identical to the one observed on the (111) surface of bulk copper. High resolution STM images show the formation of a (√3 × √7) -like sulfate structure on all multilayer copper terraces.