Berlin 2015 – wissenschaftliches Programm
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DS: Fachverband Dünne Schichten
DS 36: Poster Session I
DS 36.109: Poster
Donnerstag, 19. März 2015, 09:30–12:00, Poster A
Atomic Layer Deposition of metallic copper using novel precursors in a very small ALD setup — •Matthias Büchele1, Michael Latzel1,2, and Silke Christiansen1,3 — 1Max Planck Institute for the Science of Light, Günther-Scharowsky-Straße 1, Erlangen, Germany — 2Friedrich-Alexander-Universität Erlangen-Nürnberg, Institut of Optic, Information and Photonics, Staudstr. 7, Erlangen, Germany — 3Helmholtz Centre Berlin of Energy and Materials, Hahn-Meitner-Platz 1, Berlin, Germany
We pursued the goal, to test new precursors for Atomic Layer Deposition of metallic copper thin-films. This was done with an ultra handy evaporator/champer setup which easily can be combined with an optical microscope or Raman, due to the thin and smal chamber with transparent lid.
We have shown, that the growth mechanism is ALD and that the thin layers contain only metallic copper. Furthermore the surface was determined to be very smoth by AFM measurements.
We will show EDX, AFM and PL measurements of our samples. Latter were done in situ, meaning in real time during the process, so one can see the Signal change from cycle to cycle over the whole deposition time.