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DS: Fachverband Dünne Schichten
DS 36: Poster Session I
DS 36.88: Poster
Donnerstag, 19. März 2015, 09:30–12:00, Poster A
Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — •Anja Förster1,5, Nicole Köhler2, Sven Zimmermann1,2, Tobias Fischer2, Christian Wagner2, Jörg Schuster1, Sibylle Gemming3,4, Stefan Schulz1, 2, and Thomas Gessner1, 2 — 1Fraunhofer ENAS, Chemnitz — 2Center for Microtechnologies, TU Chemnitz, Chemnitz — 3Institute of Physics, TU Chemnitz, Chemnitz — 4Helmholtz-Zentrum Dresden-Rossendorf, Dresden — 5cfaed, TU Dresden, Dresden
We present an in situ repair process for damaged ultra-low-k (ULK) materials. We use repair fragments to replace damaged bonds (Si-H and Si-OH) and to reinsert lost methyl groups to restore the k-value. The repair fragments are gained from plasma enhanced fragmentation of the silylation precursor Octamethylcyclotetrasiloxane (OMCTS) and Bis(dimethylamino)-dimethylsilane (DMADMS).
We show that the plasma fragments of both silylation precursors can repair the damage. Further, the oxygen containing OMCTS precursor displays a better repair performance than DMADMS. The influence of the reaction temperature and of an oxygen pretreatment was investigated.
The fragmentation of DMADMS and OMCTS is studied using density functional theory (DFT), confirming the ratio of the repair fragments in the experimental repair plasma. The repair process was also analyzed with DFT and molecular dynamics methods. An explanation for the OMCTS’s fragments better repair performance was found.