Parts | Days | Selection | Search | Updates | Downloads | Help
O: Fachverband Oberflächenphysik
O 99: Semiconductor Substrates: Structure, Epitaxy and Growth
O 99.9: Talk
Friday, March 20, 2015, 12:30–12:45, MA 042
Adding 3D to conventional SEM or FIB surface imaging information - In situ Surface Sensing and Nanoprofilometry for Focused Electron and Ion Beam Induced Processes Verification — •Frank Nouvertne1, Axel Rudzinski1, Torsten Michael1, Marc Levermann1, and Eva Maynicke2, 3 — 1Raith GmbH, Konrad-Adenauer-Allee 8, Dortmund, 44263, Germany — 2RWTH Aachen, 2. Phys. Inst., Otto-Blumenthal-Str. 28, 52074 Aachen, Germany — 3Klocke Nanotechnik GmbH, Pascalstr.17, 52076 Aachen, Germany
Recently, the bandwidth of nanofabrication applications for dedicated nanopatterning tools using Electron Beam Lithography (EBL) or FIB has significantly broadened. Some few latest generation professional and multi-technique electron and ion beam nanolithography tools even facilitate additional resistless, focused electron or ion beam induced in situ processes such as material deposition or gas enhanced etching. The number of variable parameters for such complex processes is nearly "infinite", so that an efficient in situ characterization of e.g. material deposition, milling or etching rates becomes crucial for most effective understanding and subsequent optimization of such processes.
We have implemented a nanomanipulator with nanoprofilometric capabilities, which allows efficient in situ characterization of nanostructures in 3D by collecting topographic sample surface information via line scans with approx. 10nm height resolution.
First results of direct in situ growth rate determination of focused electron beam induced material deposition (FEBID) will be presented.