Bochum 2015 – wissenschaftliches Programm
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P: Fachverband Plasmaphysik
P 17: Poster Session - Plasma Technology
P 17.2: Poster
Dienstag, 3. März 2015, 16:30–18:30, Foyer Audimax
Technological plasma etch challenges for preparation of silicon optical modulators — •Harald Richter1, David Stolarek1, Mirko Fraschke1, Steffen Marschmeyer1, Lars Zimmermann1, Stefan Meister2, Christoph Theiss2, and Hanjo Rhee2 — 1IHP, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany — 2Technische Universität Berlin, Institut für Optik und Atomare Physik, Straße des 17. Juni 135, 10623 Berlin, Germany
A combination of silicon photonic and electronic components on the same chip is a prospective approach for processing of optoelectronic integrated circuits. Optical modulation is one of the main building blocks for such circuits in the future. The present work is focused on the technological fabrication of a very small fully integrated silicon modulator device using resonator structures. Plasma etching is a key technological process step for preparation of different silicon modulator components (rib waveguides, nanowires, coupling structures and photonic crystals). Diverse hard mask stacks for the several plasma etch processes were tested and optimized. Experiments have shown the mask opening step is significant for preparation of high-performance silicon photonic modules. Thus, the disadvantage of conventional plasma etching creating rough sidewalls resulting in scattering loss and degrading the photonic device performance is overcome. A further essential requirement for a high-quality plasma etch process for photonic applications the good control over critical dimensions is realizes by accurately etch rate control and in-situ photoresist and anti-reflective coating removal after hard mask opening.