Bochum 2015 – scientific programme

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P: Fachverband Plasmaphysik

P 6: Poster Session - Diagnostics

P 6.2: Poster

Monday, March 2, 2015, 16:30–18:30, Foyer Audimax

Increased ionization during magnetron sputtering — •Fabian Haase¹, Daniel Lundin², Sven Bornholdt¹, and Holger Kersten¹ — ¹Institute of Experimental and Applied Physics, Kiel University, Germany — ²Division of Space and Plasma Physics, School of Electrical Engineering, Royal Institute of Technology, Stockholm, Sweden

In this work the influence of the process gas on the degree of ionization during magnetron sputtering is investigated. For this purpose, transient calorimetric measurements [1] were performed in a typical substrate position and in the toroidal plasma region. The transient method allows for an estimation of plasma parameters such as the electron temperature as well as the electron and ion densities, respectively. It also gives access to the total energy influx and the different contributions originating from charged and neutral particles as well as surface processes like recombination or film formation. For a comparison the experiments were performed using three different process gases, Ar, Ne and Kr. Since it is well known that the degree of ionization of the process gas and the ion impact at the substrate play an important role for the optimization of thin film properties, the knowledge of how to influence these characteristics is of great value. With Te having a greater influence on the degree of ionization than ne, this work has been focused on tailoring the electron temperature. Due to the higher ionization potential of Ne compared to Ar and Kr, a higher degree of ionization was achieved by using Neon.

[1] S. Bornholdt and H. Kersten, Eur. Phys. J. D. 67(8):167 (2013)