T 11: Halbleiter: F&E 1
Monday, March 9, 2015, 14:00–16:00, I.12.02 (HS 31)
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14:00 |
T 11.1 |
Analyses of Test beam data for the ATLAS Upgrade Readout Chip (ABC130). — •Richard Peschke for the ATLAS collaboration
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14:15 |
T 11.2 |
Messung von Modelparametern an Transistoren mit Strahlungsschäden — •Fabian Brands, Hans Krüger, Tomasz Hemperek und Norbert Wermes
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14:30 |
T 11.3 |
Bumpbonding-Verbindungstechnologien für die Forschung und Entwicklung neuer Detektoren — Tobias Barvich, Thomas Blank, Michele Caselle, Fabio Colombo, Benedikt Freund, Stefan Heindl, Bojan Hiti, Ulrich Husemann, •Simon Kudella, Hans Jürgen Simonis, Pia Steck, Marc Weber und Thomas Weiler
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14:45 |
T 11.4 |
Investigation of Toshiba 130nm CMOS process as a possible candidate for active silicon sensors in HEP and X-ray experiments — Yunan Fu, Tomasz Hemperek, Tetsuichi Kishishita, Hans Krüger, Ivan Peric, •Piotr Rymaszewski, and Norbert Wermes
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15:00 |
T 11.5 |
Chip Development in 65nm CMOS Technology for the High Luminosity Upgrade of the ATLAS Pixel Detector — Leonard Germic, Miroslav Havránek, Tomasz Hemperek, Tetsuichi Kishishita, Hans Krüger, •Piotr Rymaszewski, and Norbert Wermes
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15:15 |
T 11.6 |
Planar pixel sensors in commercial CMOS technologies — •Laura Gonella, Tomasz Hemperek, Fabian Hügging, Hans Krüger, Anna Macchiolo, and Norbert Wermes
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15:30 |
T 11.7 |
Characterization of Active CMOS Sensors for Capacitively Coupled Pixel Detectors — •Toko Hirono, Laura Gonella, Jens Janssen, Tomasz Hemperek, Fabian Hügging, Hans Krüger, Norbert Wermes, and Ivan Peric
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15:45 |
T 11.8 |
Charakterisierung von HVCMOS Pixeldetektoren für den HL-LHC — Jörn Große-Knetter, Arnulf Quadt, •Julia Rieger und Jens Weingarten
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